surface mount capacitors 1.1 - production process fowchart 1.2 - syfer reliability grades 1.1 to 1.3 internal inspection rumble multilayer build (wet process) fire ceramic powder preparatio n electrode in k materia l termination electrical test test verification packaging finished goods stor e plating (if specified) qc inspection additional hi rel activities (s02a & s05 100% burn-in, qc insp ) additional sample rel tests (if specified) printing (if specified) standard components mil grade (2) iecq-cec c (3) aec-q200 (4) spac e grade escc 3009 (1) standard reliabilit y high reliabilit y (space quality) 1.3 - syfer reliability surface mount product groups standard flexicap tm capacitors (3) open mode flexicap tm capacitors (2) tandem flexicap tm capacitors (1) standard reliabilit y high reliabilit y standard mlc capacitor (4) notes: (1) tandem construction capacitors, ie internally having the equivalent of 2 series capacitors. if one of these should fail short-circuit, there is still capacitance end to end and the chip will still function as a capacitor, although capacitance maybe affected. refer to application note an0021. also available qualifed to aec-q200. (2) open mode capacitors with flexicap tm termination also reduce the possibility of a short circuit by utilising inset electrode margins. refer to application note an0022. also available qualifed to aec-q200. (3) multilayer capacitors with syfer flexicap tm termination. by using flexicap tm termination, there is a reduced possibility of the mechanical cracking occurring. (4) standard capacitors includes mlccs with tin fnish over nickel, but no flexicap tm . notes: (1) space grade tested in accordance with escc 3009. refer to syfer specifcation s02a 0100. (2) mil grade. released in accordance with us standards available on request. (3) iecq-cecc. the international electrotechnical commission (iec) quality assessment system for electronic components. this is an internationally recognised product quality certifcation which provides customers with assurance that the product supplied meets high quality standards. view syfers iecq-cecc approvals at http://www.iecq.org or at www.syfer.com (4) aec-q200. automotive electronics council stress test qualifcation for passive components. refer to syfer application note reference an0009. 4
surface mount capacitors 1.4 1.4 - flexicap ? termination mlccs are widely used in electronic circuit design for a multitude of applications. their small package size, technical performance and suitability for automated assembly makes them the component of choice for the specifer. however, despite the technical benefts, ceramic components are brittle and need careful handling on the production foor. in some circumstances they may be prone to mechanical stress damage if not used in an appropriate manner. board fexing, depanelisation, mounting through hole components, poor storage and automatic testing may all result in cracking. careful process control is important at all stages of circuit board assembly and transportation - from component placement to test and packaging. any signifcant board fexing may result in stress fractures in ceramic devices that may not always be evident during the board assembly process. sometimes it may be the end customer who fnds out - when equipment fails! syfer has the solution - flexicap? flexicap tm has been developed as a result of listening to customers experiences of stress damage to mlccs from many manufacturers, often caused by variations in production processes. our answer is a proprietary fexible epoxy polymer termination material, that is applied to the device under the usual nickel barrier fnish. flexicap tm will accommodate a greater degree of board bending than conventional capacitors. syfer flexicap? termination all ranges are available with flexicap? termination material offering increased reliability and superior mechanical performance (board fex and temperature cycling) when compared with standard termination materials. refer to syfer application note reference an0001. flexicap? capacitors enable the board to be bent almost twice as much before mechanical cracking occurs. refer to application note an0002. flexicap? is also suitable for space applications having passed thermal vacuum outgassing tests. refer to syfer application note reference an0026. fired ceramic dielectric flexicap tm termination base intermediate nickel layer t in outer layer metal electrodes flexicap tm mlcc cross section application notes flexicap tm may be handled, stored and transported in the same manner as standard terminated capacitors. the requirements for mounting and soldering flexicap tm are the same as for standard smd capacitors. for customers currently using standard terminated capacitors there should be no requirement to change the assembly process when converting to flexicap tm . based upon board bend tests in accordance with iec 60384-1 the amount of board bending required to mechanically crack a flexicap tm terminated capacitor is signifcantly increased compared with standard terminated capacitors. it must be stressed however, that capacitor users must not assume that the use of flexicap tm terminated capacitors will totally eliminate mechanical cracking. good process controls are still required for this objective to be achieved. picture taken at 1,000x magnifcation using a sem to demonstrate the fbrous nature of the flexicap tm termination that absorbs increased levels of mechanical stress. available on the following ranges: all high reliability ranges standard and high voltage chips surge protection and safety capacitor chips 3 terminal emi chips x2y integrated passive components x8r high temperature capacitors summary of pcb bend test results the bend tests conducted on x7r have proven that the flexicap tm termination withstands a greater level of mechanical stress before mechanical cracking occurs. the aec-q200 test for x7r requires a bend level of 2mm minimum and a cap change of less than 10%. product x7r typical bend performance under aec-q200 test conditions standard termination 2mm to 3mm flexicap? typically 8mm to 10mm flexicap? benefts with traditional termination materials and assembly, the chain of materials from bare pcb to soldered termination, provides no fexibility. in circumstances where excessive stress is applied - the weakest link fails. this means the ceramic itself, which may fail short circuit. the beneft to the user is to facilitate a wider process window - giving a greater safety margin and substantially reducing the typical root causes of mechanical stress cracking. flexicap tm may be soldered using your traditional wave or refow solder techniques and needs no adjustment to equipment or current processes. syfer has delivered millions of flexicap tm components and during that time has collected substantial test and reliability data, working in partnership with customers world wide, to eliminate mechanical cracking. an additional beneft of flexicap? is that mlccs can withstand temperature cycling -55oc to 125oc in excess of 1,000 times without cracking. 5
surface mount capacitors 1.5 to 1.7 1.7 - rohs compliance all syfer surface mount capacitors (excluding sn/pb plated) are compliant with the eu rohs directive. breakdown of materials content is available on request. syfer reliability sm product group standard sm capacitors iecq-cecc aec-q200 mil - prf 55681 (1) s (space grade) high rel s05 s02a (3) solderability resistance to soldering heat plating thickness verifcation (if plated) destructive physical analysis (dpa) voltage proof test (dwv / flash) insulation resistance capacitance test dissipation factor test 100% visual inspection m m m 100% burn-in (2) . (2xrv @125oc for 100 hours) m m m - - 100% burn-in (2) . (2xrv @125oc for 168 hours) m m m - load sample test @ 125oc. (life at elevated temperature test). m m m m m lat1 & lat2 (1000 hours) humidity sample test. 85oc/85%rh m m m m m 240 hours hot ir sample test m m m m m axial pull sample test (mil-std-123) m m m m m m breakdown voltage sample test m m m m m m defection (bend) sample test m m m m m m sam (scanning acoustic microscopy) m m m m m m lat1 (4 x adhesion, 8 x rapid temp change + lat2 and lat3) - - - - - m lat2 (20 x 1000 hour life test + lat3) - - - - - m lat3 (6 x tc and 4 x solderability) - - - - - m test conducted as standard. m optional test. please discuss with syfer sales. notes: 1) in accordance with mil-prf-55681 group a. additional optional tests available. 2) burn-in also referred to as voltage conditioning. 3) in accordance with escc 3009. 1.5 - tests conducted during batch manufacture 1.6 - precious metal electrodes vs. base metal electrodes multilayer ceramic capacitors typically require sintering temperatures in excess of 1000oc, which presents no problems to capacitors that employ a precious metal electrode (pme) system. however, for base metal electrode (bme) systems additional processes are required, including the use of a reducing atmosphere to prevent oxidation of the electrodes. despite the manufacturing problems, bme multilayer ceramic capacitors have proven to be a good choice for commercial products as they have reasonable electrical properties and life expectancy and can be used for some high reliability applications when properly qualifed and screened. at syfer technology we have been developing pme systems for over thirty years and use them exclusively for all our product lines. it produces capacitors to the highest reliability that can be used in all applications including the very demanding space requirements. a recent highly accelerated life test (halt) programme was undertaken to compare syfer pme with equivalent bme capacitors. capacitors rated at 50 volts were tested at 400 volts and at a temperature of 180oc. the programme used three capacitor types from syfer and two bme manufacturers. 25 20 15 10 5 0 median t ime to failure 0603 50v 33nf 0805 50v 100nf 1206 50v 220nf s y fer pme bme1 bme2 in all cases the syfer pme parts out-performed the bme capacitors suggesting that the long term reliability of pme systems is superior to bme, and pme parts should be regarded as the component of choice for high reliability applications. 6
surface mount capacitors 1.8 to 1.10 release documentation supplied as standard. m original documentation. syfer reliability sm product group standard sm capacitors iecq-cecc aec-q200 mil grade s (space grade) high rel s05 s02a certifcate of conformance - iecq-cecc release certifcate of conformity - - - - batch electrical test report m m m included in data pack included in data pack s (space grade) data documentation package - - - 1.8 - release documentation component type: 0805 (c0g/np0 and x7r). testing location: syfer reliability test department. results based on: 14,942,000 component test hours. from to operation fits mtbf (hours) 10 9 fits fits mtbf (years) 10 9 (fits x 8760) fits = failures in 10 9 hours. mtbf = mean time between failures. conversion factors: 1.10 - periodic tests conducted and reliability data availability standard surface mount capacitors components are randomly selected on a sample basis and the following routine tests are conducted: load test. 1000 hours @125oc. applied voltage depends on components tested. humidity test. 168 hours @ 85oc/85%rh. board defection (bend test). test results are available on request. 25oc 50oc 75oc 100oc 125oc 10000 0.01 10 0.00001 fi t 10% of rv 50% of rv 25% of rv rv example of fit (failure in time) data available: 1.9 - technical summary c0g/np0 x7r dielectric characteristics ultra stable stable iecq-cecc eia mil 1b/cg 2c1 2r1 2x1 c0g/np0 x7r cg(bp) bz bx rated temperature range -55oc to +125oc -55oc to +125oc maximum capacitance change over temperature range no dc voltage applied 0 30 ppm/oc 20% 15% 15% rated dc voltage applied - +20-30% - +15-25% syfer dielectric ordering code c r x b tangent of loss angle (tan ) cr > 50pf 0.0015 cr 50pf = 0.0015 ( 15 + 0.7) cr the table above highlights the difference in coding for iecq-cecc, eia and mil standards when defning the temperature coeffecient and the voltage coeffcient. 7
surface mount capacitors 1.10 - periodic tests conducted for iecq-cecc and aec-q200 test ref test termination type d or nd additional requirements sample acceptance reference p n c p1 high temperature exposure (storage) all types d un-powered. 1000 hours @ t=150oc. measurement at 24 2 hours after test conclusion 12 77 0 mil-std-202 method 108 p2 temperature cycling c0g/np0: all types x7r: y and h only d 1000 cycles -55oc to +125oc measurement at 24 2 hours after test conclusion 12 77 0 jesd22 method ja-104 p3 moisture resistance all types d t = 24 hours/cycle. note: steps 7a and 7b not required. un-powered. measurement at 24 2 hours after test conclusion 12 77 0 mil-std-202 method 106 p4 biased humidity all types d 1000 hours 85oc/85%rh. rated voltage or 50v whichever is the least and 1.5v. measurement at 24 2 hours after test conclusion 12 77 0 mil-std-202 method 103 p5 operational life all types d condition d steady state ta=125oc at full rated. measurement at 24 2 hours after test conclusion 12 77 0 mil-std-202 method 108 p6 resistance to solvents all types d note: add aqueous wash chemical. do not use banned solvents 12 5 0 mil-std-202 method 215 p7 mechanical shock c0g/np0: all types x7r: y and h only d figure 1 of method 213. condition f 12 30 0 mil-std-202 method 213 p8 vibration c0g/np0: all types x7r: y and h only d 5g for 20 minutes, 12 cycles each of 3 orientations. note: use 8 x 5 pcb 0.031 thick 7 secure points on one long side and 2 secure points at corners of opposite sides. parts mounted within 2 from any secure point. test from 10-2000hz 12 30 0 mil-std-202 method 204 p9 resistance to soldering heat all types d condition b, no pre-heat of samples: single wave solder - procedure 2 3 12 0 mil-std-202 method 210 p10 thermal shock c0g/np0: all types x7r: y and h only d -55oc/+125oc. number of cycles 300. maximum transfer time - 20 seconds, dwell time - 15 minutes. air-air 12 30 0 mil-std-202 method 107 p11 adhesion, rapid temp change and climatic sequence x7r: a, f and j only d 5n force applied for 10s, -55oc/ +125oc for 5 cycles, damp heat cycles 12 27 0 bs en132100 clause 4.8, 4.12 and 4.13 p12 board fex c0g/np0: all types x7r: y and h only d 3mm defection class i 2mm defection class ii 12 30 0 aec-q200-005 p13 x7r: a, f and j only d 1mm defection. 12 12 0 bs en132100 clause 4.9 p14 terminal strength all types d force of 1.8kg for 60 seconds 12 30 0 aec-q200-006 p15 beam load test all types d - 12 30 0 aec-q200-003 p16 damp heat steady state all types d 56 days, 40c/93%rh, 15 x no volts, 15 x 5vdc, 15 x rated voltage or 50v whichever is the less 12 45 0 bs en132100 clause 4.14 1.10 test results are available on request. 8
surface mount capacitors 1.11 - standard product ranges - 10v to 6kv ranges capacitance values f. 1.11 note: * indicates components that require conformal coating post soldering. 0603 0805 1206 1210 1808 1812 1825 2220 2225 3640 5550 8060 10v c0g/np0 0.47p-3.9n 1.0p-15n 1.0p-47n 3.9p-100n 4.7p-100n 10p-220n 10p-470n 10p-470n 10p-560n n/a n/a n/a x7r 100p-100n 100p-330n 100p-1.0 330n-1.5 100p-1.5 150n-3.3 220n-4.7 220n-5.6 330n-6.8 n/a n/a n/a x5r 120n-150n 390n-680n 100p-1.5 330p-3.3 100p-2.7 150p-10 220p-15 220p-18 330p-22 n/a n/a n/a 16v c0g/np0 0.47p-2.7n 1.0p-12n 1.0p-33n 3.9p-68n 4.7p-68n 10p-180n 10p-330n 10p-330n 10p-470n n/a n/a n/a x7r 100p-100n 100p-330n 100p-1.0 330p-1.5 100p-1.5 150p-3.3 220p-4.7 220p-5.6 330p-6.8 n/a n/a n/a x5r 100p-120n 100p-470n 100p-1.2 330p-2.7 100p-2.2 150p-6.8 220p-12 220p-12 330p-15 n/a n/a n/a 25v c0g/np0 0.47p-2.2n 1.0p-10n 1.0p-27n 3.9p-56n 4.7p-47n 10p-150n 10p-220n 10p-220n 10p-330n n/a n/a n/a x7r 100p-100n 100p-220n 100p-820n 330p-1.2 100p-1.2 150p-2.2 220p-3.9 220p-4.7 330p-5.6 n/a n/a n/a x5r 100p-100n 100p-390n 100p-1.0 330p-2.2 100p-1.5 150p-4.7 220p-10 220p-10 330p-12 n/a n/a n/a 50/63v c0g/np0 0.47p-1.5n 1.0p-5.6n 1.0p-22n 3.9p-33n 4.7p-33n 10p-100n 10p-150n 10p-150n 10p-220n 10p-330n 390p-680n 680p-1.0 x7r 100p-47n 100p-220n 100p-470n 330p-1.0 100p-680n 150p-2.2 220p-1.8 220p-3.3 330p-3.3 470p-10 1.0n-15 2.2n-22 x5r 100p-68n 100p-330n 100p-680n 330p-1.5 100p-1.0 150p-3.3 220p-6.8 220p-6.8 330p-10 n/a n/a n/a 100v c0g/np0 0.47p-470p 1.0p-2.2n 1.0p-8.2n 3.9p-18n 4.7p-18n 10p-47n 10p-68n 10p-68n 10p-82n 10p-270n 390p-470n 680p-680n x7r 100p-33n 100p-100n 100p-330n 330p-680n 100p-560n 150p-1.5 220p-1.5 220p-2.2 330p-2.7 470p-5.6 1n-10 2.2n-15 200/250v c0g/np0 0.47p-150p 1.0p-820p 1.0p-2.7n 3.9p-6.8n 4.7p-6.8n 10p-15n 10p-27n 10p-27n 10p-39n 10p-100n 390p-220n 680p-330n x7r 100p-10n 100p-56n 100p-150n 330p-330n 100p-270n 150p-680n 220p-1.0 220p-1.0 330p-1.5 470p-3.3 1.0n-5.6 2.2n-10 500v c0g/np0 0.47p-68p* 1.0p-390p 1.0p-1.5n 3.9p-4.7n 4.7p-3.9n 10p-10n 10p-18n 10p-15n 10p-22n 10p-68n 390p-150n 680p-220n x7r 100p-1.5n* 100p-10n 100p-47n 330p-120n 100p-120n 150p-330n 220p-560n 220p-560n 330p-820n 470p-1.0 1.0n-1.8 2.2n-3.3 630v c0g/np0 n/a 1.0p-180p 1.0p-1.0n 3.9p-1.8n 4.7p-2.2n 10p-5.6n 10p-10n 10p-10n 10p-15n 10p-39n 390p-68n 680p-150n x7r n/a 100p-6.8n 100p-33n 330p-47n 100p-68n 150p-180n 220p-180n 220p-330n 330p-390n 470p-680n 1.0n-1.2 2.2n-2.2 1kv c0g/np0 n/a 1.0p-100p 1.0p-470p 3.9p-1.2n 4.7p-1.2n 10p-3.3n 10p-6.8n 10p-8.2n 10p-10n 10p-22n 390p-39n 680p-68n x7r n/a 100p-4.7n 100p-27n 330p-33n 100p-47n 150p-100n 220p-120n 220p-120n 330p-150n 470p-180n 1.0n-390n 2.2n-1.0 1.2kv c0g/np0 n/a n/a 1.0p-220p 3.9p-680p 4.7p-1.0n 10p-2.2n 10p-3.9n 10p-4.7n 10p-6.8n 10p-18n 390p-33n 680p-47n x7r n/a n/a 100p-15n 330p-10n 100p-10n 150p-33n 220p-68n 220p-82n 330p-100n 470p-150n 1.0n-220n 2.2n-470n 1.5kv c0g/np0 n/a n/a 1.0p-180p 3.9p-470p 4.7p-680p 10p-1.5n 10p-2.7n 10p-3.3n 10p-4.7n 10p-12n 390p-22n 680p-33n x7r n/a n/a 100p-10n 330p-6.8n 100p-6.8n 150p-22n 220p-47n 220p-47n 330p-68n 470p-100n 1.0n-150n 2.2n-330n 2kv c0g/np0 n/a n/a 1.0p-150p 3.9p-220p 4.7p-270p 10p-820p 10p-1.2n 10p-1.8n 10p-2.2n 10p-5.6n 390p-10n 680p-18n x7r n/a n/a 100p-2.2n 330p-4.7n 100p-4.7n 150p-10n 220p-10n 220p-27n 330p-33n 470p-47n 1.0n-82n 2.2n-150n 2.5kv c0g/np0 n/a n/a n/a n/a 4.7p-220p 10p-680p 10p-1.0n 10p-1.5n 10p-1.8n 10p-4.7n 390p-6.8n 680p-12n x7r n/a n/a n/a n/a 100p-1.5n 150p-3.3n 220p-6.8n 220p-8.2n 330p-12n 470p-33n 1.0n-68n 2.2n-100n 3kv c0g/np0 n/a n/a n/a n/a 4.7p-180p 10p-470p 10p-820p 10p-1.2n 10p-1.5n 10p-3.3n 390p-6.8n 680p-10n x7r n/a n/a n/a n/a 100p-1.2n 150p-2.7n 220p-3.9n 220p-6.8n 330p-8.2n 470p-22n 1.0n-47n 2.2n-82n 4kv c0g/np0 n/a n/a n/a n/a 4.7p-150p* 10p-390p* 10p-680p* 10p-1.0n* 10p-1.2n* 10p-1.5n 390p-4.7n 680p-6.8n x7r n/a n/a n/a n/a 100p-1.0n* 150p-2.2n* 220p-2.2n* 220p-4.7n* 330p-5.6n* 470p-6.8n 1.0n-15n 2.2n-33n 5kv c0g/np0 n/a n/a n/a n/a 4.7p-82p* 10p-270p* 10p-470p* 10p-680p* 10p-820p* 10p-1.0n 390p-2.2n 680p-3.9n x7r n/a n/a n/a n/a 100p-680p* 150p-1.2n* 220p-1.8n* 220p-3.9n* 330p-4.7n* n/a 1.0n-10n 2.2n-22n 6kv c0g/np0 n/a n/a n/a n/a 4.7p-56p* 10p-220p* 10p-330p* 10p-470p* 10p-560p* n/a n/a n/a x7r n/a n/a n/a n/a 100p-390p* 150p-1.0n* 220p-1.5n* 220p-2.2n* 330p-2.7n* n/a n/a n/a 0603 0805 1206 1210 1808 1812 1825 2220 2225 3640 5550 8060 = x5r range 9
surface mount capacitors 1.11 1.11 - iecq-cecc maximum capacitance values. 0603 0805 1206 1210 1808 1812 2220 2225 16v c0g/np0 1.5nf 6.8nf 22nf 33nf 33nf 100nf 150nf 220nf x7r 100nf 330nf 1.0f 1.5f 1.5f 3.3f 5.6f 6.8f 25v c0g/np0 1.0nf 4.7nf 15nf 22nf 27nf 68nf 100nf 150nf x7r 56nf 220nf 820nf 1.2f 1.2f 2.2f 4.7f 5.6f 50/63v c0g/np0 470pf 2.7nf 10nf 18nf 18nf 33nf 68nf 100nf x7r 47nf 220nf 470nf 1.0f 680nf 1.5f 2.2f 3.3f 100v c0g/np0 330pf 1.8nf 6.8nf 12nf 12nf 27nf 47nf 68nf x7r 10nf 47nf 150nf 470nf 330nf 1.0f 1.5f 1.5f 200v c0g/np0 100pf 680pf 2.2nf 4.7nf 4.7nf 12nf 22nf 27nf x7r 5.6nf 27nf 100nf 220nf 180nf 470nf 1.0f 1.0f 500v c0g/np0 n/a 330pf 1.5nf 3.3nf 3.3nf 10nf 15nf 22nf x7r n/a 8.2nf 33nf 100nf 100nf 270nf 560nf 820nf 1kv c0g/np0 n/a n/a 470pf 1.0nf 1.2nf 3.3nf 8.2nf 10nf x7r n/a n/a 4.7nf 15nf 18nf 56nf 120nf 150nf 1.11 - s05, s02a (1) space grade and mil-prf-55681 (2) ranges maximum capacitance values. 0603 0805 1206 1210 1812 2220 2225 16v c0g/ np0 390pf - 1.5nf 1pf - 6.8nf 1pf - 22nf 10pf - 33nf 220pf - 100nf 470pf - 150nf 560pf - 220nf x7r 330pf - 100nf 100pf - 330nf 680pf - 1.0f 1.0nf - 1.5f 3.9nf - 3.3f 10nf - 5.6f 18nf - 6.8f 25v c0g/ np0 390pf - 1.0nf 1pf - 4.7nf 1pf - 15nf 10pf - 22nf 220pf - 68nf 470pf - 100nf 560pf - 150nf x7r 330pf - 56nf 100pf - 220nf 680pf - 820nf 1.0nf - 1.2f 3.9nf - 2.2f 10nf - 4.7f 18nf - 5.6f 50/63v c0g/ np0 0.5pf - 470pf 1pf - 2.7nf 1pf - 10nf 10pf - 18nf 220pf - 39nf 470pf - 68nf 560pf - 100nf x7r 330pf - 47nf 100pf - 220nf 680pf - 470nf 1.0nf - 1.0f 3.9nf - 2.2f 10nf - 3.3f 18nf - 3.3f 100v c0g/ np0 1pf - 330pf 1pf - 1.8nf 1pf - 6.8nf 10pf - 12nf 220pf - 27nf 470pf - 47nf 560pf - 68nf x7r 100pf - 10nf 100pf - 47nf 100pf - 150nf 1.0nf - 470nf 3.9nf - 1.0f 10nf - 1.5f 18nf - 1.5f 200v c0g/ np0 1pf - 100pf 1pf - 680pf 1pf - 2.2nf 10pf - 4.7nf 220pf - 12nf 470pf - 22nf 560pf - 27nf x7r 100pf - 5.6nf 100pf - 27nf 100pf - 100nf 1.0nf - 220nf 3.9nf - 470nf 10nf - 1.0f 18nf - 1.0f notes: 1) in accordance with escc 3009. 2) in accordance with mil-prf-55681 group a tests. 10
surface mount capacitors 1.11 to 1.13 1.12 - termination types available syfer reliability sm product group standard sm capacitors iecq-cecc aec-q200 mil-prf 55681 (1) s (space grade) high rel s05 s02a f = silver palladium. rohs compliant. n n - n n n j = silver base with nickel barrier (100% matte tin plating). rohs compliant. n n c0g/np0 dielectric only n r r a = silver base with nickel barrier (tin/lead plating with min. 10% lead). n n - n n n y = flexicap tm termination base with ni barrier (100% matte tin plating). rohs compliant. n n n n r r h = flexicap tm termination base with ni barrier (tin/ lead plating with min. 10% lead). n n - n n n n termination available. r termination available but generally not requested for space grade components. please discuss with syfer sales. notes: 1) in accordance with mil-prf-55681 group a. additional optional tests available. 1.11 - aec-q200 rev c ranges maximum capacitance values. 0603 0805 1206 1210 1812 50/63v c0g/np0 470pf 2.7nf 10nf 18nf 39nf x7r 33nf 150nf 330nf 680nf 1.5f 100v c0g/np0 330pf 1.8nf 6.8nf 12nf 27nf x7r 10nf 47nf 150nf 470nf 1f 200v c0g/np0 100pf 680pf 2.2nf 4.7nf 12nf x7r 5.6nf 27nf 100nf 220nf 470nf 500v c0g/np0 n/a 330pf 1.5nf 3.9nf 10nf x7r n/a 8.2nf 33nf 100nf 270nf 630v c0g/np0 n/a n/a 1.0nf 1.8nf 5.6nf x7r n/a n/a 10nf 27nf 150nf 1kv c0g/np0 n/a n/a 470pf 1nf 3.3nf x7r n/a n/a 4.7nf 15nf 56nf 1.13 - ordering information standard product code construction 1210 y 100 0103 j x t _ _ _ chip size termination voltage capacitance in picofarads (pf) capacitance tolerance dielectric rel release codes packaging suffx code y = flexicap tm termination base with ni barrier (100% matte tin plating). rohs compliant. h = flexicap tm termination base with ni barrier (tin/lead plating with min. 10% lead). f = silver palladium. rohs compliant. j = silver base with nickel barrier (100% matte tin plating). rohs compliant. a = silver base with nickel barrier (tin/lead plating with min. 10% lead). 010 = 10v 016 = 16v 025 = 25v 050 = 50v 063 = 63v 100 = 100v 200 = 200v 250 = 250v 500 = 500v 630 = 630v 1k0 = 1kv 1k2 = 1.2kv 1k5 = 1.5kv 2k0 = 2kv 2k5 = 2.5kv 3k0 = 3kv 4k0 = 4kv 5k0 = 5kv 6k0 = 6kv first digit is 0. second and third digits are signifcant fgures of capacitance code. the fourth digit is number of zeros following example: 0103 = 10nf <10pf b = 0.1pf c = 0.25pf d = 0.5pf > 10pf f = 1% g = 2% j = 5% k = 10% m = 20% c = c0g/np0 (1b) x = x7r (2r1) t = 178mm (7) reel r = 330mm (13) reel b = bulk pack - tubs used for specifc customer require- ments 11
surface mount capacitors 1.13 - iecq-cecc product code construction 1210 y 100 0103 j d t _ _ _ chip size termination voltage capacitance in picofarads (pf) capacitance tolerance dielectric release codes (1) packaging suffx code y = flexicap tm termination base with ni barrier (100% matte tin plating). rohs compliant. h = flexicap tm termination base with ni barrier (tin/lead plating with min. 10% lead). f = silver palladium. rohs compliant. j = silver base with nickel barrier (100% matte tin plating). rohs compliant. a = silver base with nickel barrier (tin/lead plating with min. 10% lead). 016 = 16v 025 = 25v 050 = 50v 063 = 63v 100 = 100v 200 = 200v 250 = 250v 500 = 500v 630 = 630v 1k0 = 1kv first digit is 0. second and third digits are signifcant fgures of capacitance code. the fourth digit is number of zeros following example: 0103 = 10nf <10pf b = 0.1pf c = 0.25pf d = 0.5pf > 10pf f = 1% g = 2% j = 5% k = 10% m = 20% d = x7r (2r1) with iecq- cecc release f = c0g/np0 (1b/np0) with iecq- cecc release b = 2x1/ bx released in accordance with iecq-cecc r = 2c1/ bz released in accordance with iecq-cecc t = 178mm (7) reel r = 330mm (13) reel b = bulk pack - tubs used for specifc customer require- ments 1.13 1.13 - ordering information aec-q200 product code construction 1210 y 100 0103 j e t _ _ _ chip size termination voltage capacitance in picofarads (pf) capacitance tolerance dielectric rel release codes packaging suffx code y = flexicap tm termination base with ni barrier (100% matte tin plating). rohs compliant. j = silver base with nickel barrier (100% matte tin plating). rohs compliant. (j termination not available with x7r products). 050 = 50v 063 = 63v 100 = 100v 200 = 200v 250 = 250v 500 = 500v 630 = 630v 1k0 = 1kv first digit is 0. second and third digits are signifcant fgures of capacitance code. the fourth digit is number of zeros following example: 0103 = 10nf <10pf b = 0.1pf c = 0.25pf d = 0.5pf > 10pf f = 1% g = 2% j = 5% k = 10% m = 20% a = c0g/np0 (1b) e = x7r (2r1) t = 178mm (7) reel r = 330mm (13) reel b = bulk pack - tubs used for specifc customer requirements notes: 1) a & f approved for space applications. if another termination type is required then contact syfer sales. 2) please include lot acceptance test requirement (lat1, lat2 or lat3) on purchase order against each line item. tests conducted after 100% burn-in (2xrv @125oc for 168 hours): lat1: 4 x adhesion, 8 x rapid temp change + lat2 and lat3. lat2: 20 x 1000 hour life test + lat3. lat3: 6 x tc and 4 x solderability. 1.13 - s05 and s02a product code construction 1210 a 100 0103 j x t _ _ _ chip size termination voltage capacitance in picofarads (pf) capacitance tolerance dielectric rel release codes packaging suffx code a = silver base with nickel barrier (tin/ lead plating with min. 10% lead). f = silver palladium. rohs compliant. h = flexicap tm termination base with ni barrier (tin/ lead plating with min. 10% lead). 016 = 16v 025 = 25v 050 = 50v 063 = 63v 100 = 100v 200 = 200v first digit is 0. second and third digits are signifcant fgures of capacitance code. the fourth digit is number of zeros following example: 0103 = 10nf <10pf b = 0.1pf c = 0.25pf d = 0.5pf > 10pf f = 1% g = 2% j = 5% k = 10% m = 20% c = c0g/np0 (1b) x = x7r (2r1) t = 178mm (7) reel r = 330mm (13) reel b = bulk pack - tubs q = waffe pack used for specifc customer requirements s05 = s (space grade) high rel s02a = (2) s (space grade) high rel 12
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